Metal additive manufacturing is no longer a future prospect — it is an expanding industry. The global metal AM market is projected to grow from $6.02 billion to $7.02 billion in 2026. According to the 2026 Wohlers Report, metals revenue (including powder and wire) rose 15.3% year-over-year in 2025. As infrastructure and supply chains scale, the next challenge is ensuring engineers and operators have the frameworks needed to scale production safely and reliably. ADDITIV Metals 2026, hosted by 3Dnatives and featuring speakers from NASA, General Motors, MIT, and the U.S. Department of War, is focused on answering that question. Register HERE.
The summit will be held on Wednesday, June 10, 2026, from 10:00 AM to 12:40 PM EDT (4:00 PM to 6:40 PM CEST). Attendance is free. The program includes three expert panels, live audience Q&As, and AI-powered networking. Each panel tackles a pressing barrier that is slowing industrial adoption of metal AM today. “Metal AM has been ‘almost there’ for a decade. What’s changed recently is that the conversation has shifted from ‘can it be done?’ to ‘why is it taking so long?’ ADDITIV Metals exists to accelerate that second conversation,” said Filippos Voulpiotis, Managing Director of 3Dnatives.
What Will the Panels Cover?
Panel 1: Diverse Metal Roadmaps – When to Push LPBF and When to Pivot to Alternatives (4:10 PM to 4:55 PM CEST)
Laser powder bed fusion (LPBF) is maturing as a production standard, but emerging challenger technologies are changing the cost-per-part equation. This session will help engineering teams decide when to continue investing in LPBF and when to adopt alternative processes. Panelists include Tim Smith (NASA), John Hart (MIT), and Ben Arnold (Tritone Technologies), with moderation by Brent Stucker of Wohlers Associates.
Panel 2: The Certification Trap – Can AI Kill the 2-Year Testing Cycle in Metal AM? (5:00 PM to 5:45 PM CEST)
A major bottleneck for metal AM is not machine throughput but the time it takes to prove parts will perform reliably in service. This panel explores digital qualification frameworks and evaluates whether AI-driven methods can shorten certification cycles to operationally viable timeframes. Moderated by Gil Lavi (3D Alliances), the discussion features Sneha Prabha Narra (Carnegie Mellon University), Matthew Sermon (DRPM Submarines/DoW), and Sainyam Amarora (Johnson Matthey).
Panel 3: The Hidden Majority – Is Post-Processing Still the Single Greatest Barrier to Metal AM ROI? (5:50 PM to 6:35 PM CEST)
Although fabrication has become more automated, the journey from build plate to finished part still involves labor-intensive steps: support removal, heat treatment, and surface finishing. This panel will assess whether post-processing remains the last major unsolved issue for metal AM economics. Moderated by Sherri Monroe (AMGTA), panelists include Ante Lausic (General Motors), Manuel Delgado (ValCUN), and Matthew Bailey (Aerospace Technology Institute).
Who Should Attend?
ADDITIV Metals 2026 is aimed at manufacturing executives, process engineers, AM program managers, and R&D leaders working with or evaluating metal additive manufacturing for production. If your organization is weighing LPBF against alternatives, managing qualification timelines, or seeking to reduce post-processing costs, this event delivers actionable, expert insight in under three hours.
Networking Built for the Industry
Attendees will have access to AI-powered peer matching via the Swapcard platform and can schedule one-on-one meetings before and after the sessions. The event is expected to attract more than 800 registered participants from across the global metal AM ecosystem.
Partners and Sponsors
ADDITIV Metals 2026 is supported by Tritone Technologies and ValCUN. Media partners include ASTM International, AMGTA, SPE, 3D Alliances, Wevolver, Metal AM Magazine, Manufacturing in Focus, Tooling and Production, Modern Applications News, IAM3DHUB, Manufacturing.net, Manufacturing Engineering and Technology, and 3DPrint.com.
Registration
ADDITIV Metals 2026 is free to attend. Register HERE to access the panel discussions and networking opportunities.
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