HENSOLDT and Nano Dimension create 10-layer 3D printed circuit board

Sensor solutions provider HENSOLDT together with the one of the leading Additively Manufactured Electronics (AME) providers, Nano Dimension, has achieved a major breakthrough on its way to utilizing 3D printing in the development process of high-performance electronics components. As you may know, the electronics industry is one of the least well versed in additive manufacturing. Over the last few years, the sector has been slowly integrating AM technologies into its activities for prototyping and small series production. Additive manufacturing can bring new capabilities by enabling a new-level of customization for micro and nanoscale electronics components. Clearly demonstrated by HENSOLDT and Nano Dimension’s new breakthrough.

In fact, utilizing a newly developed dielectric polymer ink and conductive ink from Nano Dimension, HENSOLDT succeeded in assembling the world-wide first 10-layer 3D printed circuit board (PCB) which carries high-performance electronic structures soldered to both outer sides. Until now, 3D printed boards could not bear the soldering process necessary for a two-sided population of components. This application could be useful for many sectors that require a high level of precision and performance. Thomas Müller, HENSOLDT CEO, explains: “Military sensor solutions require performance and reliability levels far above those of commercial components. To have high-density components quickly available with reduced effort by means of 3D printing gives us a competitive edge in the development process of such high-end electronic systems.”

Nano Dimension’s technology can produce 3D printed circuit boards | Credits: Nano Dimesion

Nano Dimension has developed and been using an inkjet 3D printing technology to produce electronic components for some years now. Based on photopolymerization, their printhead deposits dielectric nanoparticles, conductive nanoparticles and polymers onto the build plate, which are cured by UV light in between successive depositions – creating structures that are conductive and insulating at the same time.